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SHINE PEAK GROUP(HK) LIMITED

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13871831793

8 in1 Mobile Tools Kit Disassembly Blades for Repairing Computer IC Chip CPU NAND Metal Remover Hand Tools Set

  • 8 in1 Mobile Tools Kit Disassembly Blades for Repairing Computer
BASIC INFO

Color: Multicolor
Material: stainless steel
Size : Length: 16.8cm


Features:
<< Function: Designed for cell phone BGA repair and glue cleaning tool.
<< Easy to carry: Professional and practical, compact and portable for easy storage and carry.
<< Application: For BGA repair,dismantling phone CPU chip and phone repair..
<< Premium quality: Made from stainless steel material, which is sturdy and durable. Not easy to bent, , corrosion resistance, wear resistance and good toughness.
<< Good performance: High precision hand tools, easy to use, improving your work efficiently.
<< Multi use: The BGA chip repair blades is used to remove CPU chips, repair the motherboard.
<< Ergonomic design: Non slip, ergonomic handle for easy grip.

Notes:
1. Please allowed 1-3mm differences due to manual measurement, thank you!
2. Due to the difference between different monitors, please understand that the picture may not reflect the actual color of the item.

Package list:
1set* mobile phone removal tool

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Company: SHINE PEAK GROUP(HK) LIMITED

Contact: David Huang

Tel: 13871831793

Phone: +8613871831793

E-mail: shinepeakgroup_david@aliyun.com

Address: Room 1102,Unit 8,Building 4,Liantou Hankoujun,Wuhan City,China